Wafer bonding

Wafer bonding is a packaging technology on wafer-level for the fabrication of microelectromechanical systems (MEMS), nanoelectromechanical systems (NEMS), microelectronics and optoelectronics, ensuring a mechanically stable and hermetically sealed encapsulation. The wafers` diameter range from 100 mm to 200 mm (4 inch to 8 inch) for MEMS/NEMS and....
Found on http://en.wikipedia.org/wiki/Wafer_bonding
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