1. 
   TAB = Tape Automated Bonding
   A process for interconnecting an integrated circuit die to the substrate surface using a fine lead frame supported by a carrier film (usually Kapton tape). The TAB process starts by bonding the IC die to the patterned inner leads on the tape, generally followed by testing. In a separate operation, ...
   Found op http://www.ami.ac.uk/courses/topics/0100_gls/glossary/glosst.htm
   
   

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